Conference Grant

From time to time, the Hong Kong Pain Society (HKPS) may invite applications from its members to apply for HKPS conference grants to attend local and overseas academic conferences.


HKPS Second Conference Grant Invitation 2015

 

The Second Conference Grant Invitation of the Hong Kong Pain Society 2015 is now open to application.

The Regular and life members of the Hong Kong Pain Society are invited to apply for the grant to attend overseas international conference on pain management and preferably involving multidisciplinary participation. The grant will cover the conference registration fees and return economy air-passage with a maximum of HKD15,000.

For application, please return the completed form to the Secretariat together with the relevant information of the conference you plan to attend.


Click here for details

 

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